Cu-bonded ceramic substrates consist of the ceramic insulating layer and the metal copper circuit layer. In electronic packaging, the substrate is one of the essential materials used in semiconductor power modules, and plays a critical role both in connecting internal and external heat dissipation channels, and providing electrical interconnection and mechanical support.
With the development of the integrated circuit industry, power electronic devices are evolving towards higher voltage, larger current, higher power density, and smaller sizes. Therefore, an efficient heat dissipation system is an essential component of high-integrated circuits. This requires substrate materials to have both excellent mechanical reliability and high thermal conductivity.
Highly automated manufacturing equipment ensures timely production, and Ferrotec guarantees on-schedule delivery for all our customers.
Fully automated manufacturing equipment and a robust system process ensure stable yield output.
With the availability of strictly-implemented 6S management in our manufacturing plants, we’re able to reduce waste in workforce, materials, machinery, etc.